Width calculation

Discussion in 'Cadence' started by llipschutz, Feb 12, 2007.

  1. llipschutz

    llipschutz Guest

    I'm a relative beginner to extraction routines, and I was wondering if
    someone could help out here. I am trying to measure the resistance of
    a dog-bone resistor created in an SOI process. The layout of the
    device looks like the following: (I apologize for the poor ASCII
    diagram)
    ______
    | |
    | [] | _ Resistor Head with contact in center
    |__ __| /\
    | | |
    | | |
    | | | Resistor Body (Length Parameter)
    | | |
    __| | __ \/
    | | _
    | [] | Resistor Head with contact in center
    |______|

    |<->| Resistor Body (Width parameter)

    My problem is the resistor body goes from contact to contact, and is
    surrounded by material not factored in to the resistance equation. Is
    there a way to directly calculate the width or length of the resistor,
    as is stretches inside the head from contact to contact? I can
    measure the perimeter, and calculate the width from there (or vice-
    versa), but I need either width or length to calculate the other.
     
    llipschutz, Feb 12, 2007
    #1
  2. llipschutz

    AxisIC Guest

    I assume this is a poly-silicide process.
    The resistor body is where the silicide is blocked.
    This is what shoulld be calculated.
    The R value of the head is so low compared
    to the body that it is discarded. Check your manual.
    I bet gate poly has a low value & Res-poly has a high.
    Colin
     
    AxisIC, Feb 12, 2007
    #2
  3. llipschutz

    gerry Guest

    For generic technologies, the end effects are often left out.

    I have seen several analog flows that mandate a more accurate
    approach.

    I.E.

    R = (Rho * Leff / Weff) + 1/Weff * Rend

    Where the value of Leff is typically shorter than the distance between
    the end
    contact array structures by a required/mandated amount. This is
    sometimes forced
    by the inclusion of End implants to reduce variability in high
    precision resistors.

    The way that I generate the Rbody is to oversize the end contact
    structures
    (usually by some amount that is both ( greater than the end contact
    spacing)
    and ( just! smaller than the Rend to Rend spacing) and then I remove
    this from
    then Resistor structure and then I oversize the result by the
    difference between
    this number and the min/expected Rend to Rbody spacing. This becomes
    the Rbody
    of the resistor and is the device recognition layer.

    The remander of the Resistor layer is added to or becomes its own
    conductor.

    The value of Rend should be supplied by the fab. ( note that in cases
    where the
    end resistance is << rho, it can be that any Rend effect is swamped by
    resistor
    tolerance ... and is often ignored.

    YMMV
     
    gerry, Feb 20, 2007
    #3
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