RCX extraction of Power transistors

Discussion in 'Cadence' started by Jagadeesh M, Mar 30, 2005.

  1. Jagadeesh M

    Jagadeesh M Guest

    Folks,
    We have a situation where we have a huge POWER transistors. The
    width(Width-per-finger) of the transistors is huge, by default RCX models
    each finger as a single MOS device. It will collapse all the
    Metal-to-contact resistors and it will connect the the center point of src/drain
    metal1 to the transistor. This method of extraction is fine for a normal
    application. But for huge power transistors this will be inaccurate since you
    are modeling the MOS with big W(let's assume W=200um) as a single device. The
    best way to model it is to break a single finger of transistor into multiple
    devices along its width so that the single MOS is modelled as a distributed
    device. This will be a accurate way to model this. How can acheive this using
    RCX ? Let me know if you need mode details.

    Rgds,
    Jagi.
     
    Jagadeesh M, Mar 30, 2005
    #1
  2. Jagadeesh M

    G Vandevalk Guest

    I understand your problem. I do not think RCX (or any other parasitic
    extraction solution) will help.

    I think you need to work with your modeling provider in this case.

    When you break the mosfet into bits, you will bring in all sorts of modeling
    effects that are not real (i.e short channel and narrow channel effects,
    etc.)

    What you need to do is get a model of the mosfet that models as manny of the
    effects as you can.

    One way would be to model each finger and add parasitics to the model as
    required.
    (i.e. contact, metal, etc.)

    Remember that the extracted device is ideal to the RCX world.

    -- G
     
    G Vandevalk, Mar 30, 2005
    #2
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