I am planning to fab a chip with Mosis. I have a question about their scalable cmos pad frames. I understand the reason behind scalable cmos and it provides and easy conversion between feature sizes. I downloaded the padframe for the AMIS C5 process, and I was wondering that since the layout and padframe have different layers will the Metal 1 layer and M1_pin layer be recognized as going together. Or is there some conversion that is done to insure a good layout to pin interface. Thanks