CALL FOR PAPERS ISQED 2007 8th International Symposium & Exhibits on QUALITY ELECTRONIC DESIGN March 26-28, 2007. San Jose, CA, USA www.isqed.org Leading Design for Quality & ManufacturabilityT Paper Submission Deadline: September 30, 2006 Acceptance Notifications: November 23, 2006 Final Camera-Ready paper: January 3, 2007 -------------------------------------------------------------------------------- ISQED is the pioneer and leading international conference dealing with the design for manufacturability and quality issues front-to-back. ISQED spans three days, Monday through Wednesday, in three parallel tracks, hosting near 100 technical presentations, six keynote speakers, two-three panel discussions, workshops /tutorials and other informal meetings. Conference proceedings are published by IEEE and hosted in the digital library. Proceedings CD ROMs are published by ACM. In addition, continuing the tradition of reaching a wider readership in the IC design community, ISQED will continue to publish special issues in leading journals. The authors of high quality papers will be invited to submit an extended version of their papers for the special journal issues. Papers are requested in the following areas: A pioneer and leading multidisciplinary conference, ISQED accepts and promotes papers related to the manufacturing, VLSI design and EDA. Authors are invited to submit papers in the various disciplines of high level design, circuit design, test & verification, design automation tools; processes; flows, device modeling, semiconductor technology, and advance packaging. 1. Manufacturing, Semiconductor Process and Devices 1.1 Design for Manufacturability/Yield & Quality (DFM/DFY/DFQ) 1.2 Effects of Technology on IC Design, Performance, Reliability, and Yield (TRD) 2. Design 2.1 System-level Design, Methodologies & Tools (SDM) 2.2 Package - Design Interactions & Co-Design (PDI) 2.3 Robust & Power-conscious Devices, Interconnects, and Circuits (RDIC) 2.4 Emerging/Innovative Process & Device Technologies and Design Issues (EDT) 2.5 Design of Reliable Circuits and Systems (DFR) 3. EDA/CAD 3.1 EDA Methodologies, Tools, Flows & IP Cores; Interoperability and Reuse (EDA) 3.2 Design Verification and Design for Testability (DVFT) 3.3 Physical Design, Methodologies & Tools (PDM) The details of various topics of paper submission is as follows: Design for Manufacturability/Yield & Quality (DFM/DFY/DFQ) DFM/DFY/DFQ definitions, methodologies, matrices, and standards. Quality-based design methodologies and flows for custom, semi-custom, ASIC, FPGA, RF, memory, networking circuit, etc. Design flows and methodologies for SoC, and SiP. Analysis, modeling, and abstraction of manufacturing process parameters and effects for highly predictable silicon performance. Design and synthesis of ICs considering factors such as: signal integrity, transmission line effects, OPC, phase shifting, and sub-wavelength lithography, manufacturing yield and technology capability. Design for diagnosability, defect detection and tolerance; self-diagnosis, calibration and repair. Design and manufacturabilty issues for Digital, analog, mixed signal, RF, MEMS, opto-electronic, biochemical-electronic, and nanotechnology based ICs. Redundency and other yield improving techniques. Global, social, and economic implications of design quality. Physical Design, Methodologies & Tools (PDM) Physical design for manufacturing; Physical synthesis flows for correct-by-construction quality silicon, implementation of large SoC designs. Tool frameworks and data-models for tightly integrated incremental synthesis, placement, routing, timing analysis and verification. Placement, optimization, and routing techniques for noise sensitivity reduction and fixing. Algorithms and flows for harnessing crosstalk-delay during physical synthesis. Tool flows and techniques for antenna rule and electromigration rule avoidance and fixing. Spare-cell strategies for ECO, decoupling capacitance and antenna rule fixing. Physical planning tools for predictable power-aware circuits. Reliable clock tree generation and clock distribution methodologies for Gigahertz designs. EDA tools, design techniques, and methodologies, dealing with issues such as: timing closure, R, L, C extraction, ground/Vdd bounce, signal noise/cross-talk /substrate noise, voltage drop, power rail integrity, electromigration, hot carriers, EOS/ESD, plasma induced damage and other yield limiting effects, high frequency effects, thermal effects, power estimation, EMI/EMC, proximity correction & phase shift methods, verification (layout, circuit, function, etc.). Design Verification and Design for Testability (DVFT) Hardware and Software, Formal and simulation based design verification techniques to ensure the functional correctness of hardware early in the design cycle. DFT and BIST for digital and SoC. DFT for analog/mixed-signal ICs and systems-on-chip, DFT/BIST for memories. Test synthesis and synthesis for testability. DFT economics, DFT case studies. DFT and ATE. Fault diagnosis, IDDQ test, novel test methods, effectiveness of test methods, fault models and ATPG, and DPPM prediction. SoC/IP testing strategies. Design methodologies dealing with the link between testability and manufacturing. EDA Methodologies, Tools, Flows & IP Cores; Interoperability and Reuse (EDA) EDA tools addressing design for manufacturing, yield, and reliability. Management of design process, design flows and design databases. EDA tools interoperability issues and implications. Effect of emerging technologies, processes & devices on design flows, tools, and tool interoperability. Emerging EDA standards. EDA design methodologies and tools that address issues which impact the quality of the realization of designs into physical integrated circuits. IP modeling and abstraction. Design and maintenance of technology independent hard and soft IP blocks. Methods and tools for analysis, comparison and qualification of libraries and hard IP blocks. Challenges and solutions of the integration, testing, qualifying, and manufacturing of IP blocks from multiple vendors. Third party testing of IP blocks. Risk management of IP reuse. IP authoring tools and methodologies. Robust & Power-conscious Devices, Interconnects, and Circuits (RDIC) Device, substrate, interconnect, circuit , and IP block modeling and simulation techniques; CMOS, Bipolar, and SiGe HBTs device modeling in the context of advanced digital, RF and high-speed circuits. Modeling and simulation of novel device and interconnect concepts. Signal integrity analysis: coupling, inductive and charge sharing noise; noise avoidance techniques. Modeling statistical process variations to improve design margin and robustness, use of statistical circuit simulators. Power grid design, analysis and optimization; timing analysis and optimization; thermal analysis and design techniques for thermal management. Power-conscious design methodologies and tools; low power devices, circuits and systems; power-aware computing and communication; system-level power optimization and management. Design techniques for leakage current management. Design of robust 3D Integrated Circuits. Successful applications of TCAD to circuit design. Impacts of process technologies on circuit design and capabilities (e.g. low-Vt transistors versus increased off-state leakages) and the accuracy, use and implementation of SPICE models that faithfully reflect process technologies. Emerging/Innovative Process & Device Technologies and Design Issues (EDT) Emerging processes & device technologies and implications on IC design with respect to design's time to market, yield, reliability, and quality. Emerging issues in DSM CMOS: e.g. sub-threshold leakage, gate leakage, technology road mapping and technology extrapolation techniques. New and novel technologies such as SOI, Double-Gate (DG)-MOSFET, Gate-All-Around (GAA)-MOSFET, Vertical-MOSFET, strained CMOS, high-bandwidth metallization, 3D integrated circuits, nanodevices, etc. Package - Design Interactions & Co-Design (PDI) Concurrent circuit, package, and PCB/PWB design and effect on quality. EDA tools and methodologies dealing with the IC Packaging electrical and thermal modeling and simulation for improved quality of product. SoC versus system in a package (SiP): design and technology solutions and tradeoffs; MCM, BGA, Flip Chip, and other innovative packaging techniques for various applications such as mixed-signal and RFIC. Design of Reliable Circuits and Systems (DFR) Device and process reliability issues and effect on design of reliable circuits and systems. ESD design for digital, mixed signal and RF applications. Exploration of critical factors such as noise, substrate coupling, cross-talk and power supply noise. Significance and trends in process reliability effects such as gate oxide integrity, electromigration, ESD, etc., and their relation to electronic design. System-level Design, Methodologies & Tools (SDM) Emerging system-level design paradigms, methods and tools aiming at quality. System-level design process and flow management. System-level design modeling, analysis and synthesis, estimation and verification for correct high-quality hardware/software systems. Responsive, secure, and defect tolerant systems. New concepts, methods and tools addressing system-level design complexity and multitude of aspects. Methods and tools addressing the usage of technology information and manufacturing feedback in the system-, RTL- and logic level design. The influence of the nanometer technologies' (application-dependent) yield and other issues on the system-, RTL- and logic-level design. System-level trade-off analysis and multi-objective (yield, power, delay, area .) optimization. Effective and efficient design, implementation, analysis and validation of large SoCs integrating IP blocks from multiple vendors. Global, Social, and Economical Implications of Electronic System and Design Quality. Emerging standards and regulations influencing system quality. Submission of Papers Paper submission must be done on-line via the conference web site at www.isqed.org. Authors should submit FULL-LENGTH, original, unpublished papers (Minimum 4, maximum 6 pages) along with an abstract of about 200 words. Please check the as-printed appearance of your paper before uploading. To permit a blind review, do not include name(s) or affiliation(s) of the author(s) on the manuscript and abstract. The complete contact author information needs to be entered separately. When ready to submit your paper have the following information ready: I Title of the paper II Name, affiliation, complete mailing address and phone, fax, and email of the first author III Name, affiliations, city, state, country of additional authors IV Person to whom correspondence should be sent, if other than the 1st author V Suggested area (as listed above) The guidelines for the final paper format are provided on the conference web site at www.isqed.org. Authors of the submitted papers must register and attend the conference for their paper to be published. Please note the following important dates: Paper Submission Deadline: September 30, 2006 Acceptance Notifications: November 23, 2006 Final Camera-Ready paper: January 3, 2007 About ISQED The International Symposium on Quality Electronic Design (ISQED), is a premier Design & Design Automation conference, aimed at bridging the gap between and integration of, electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design quality. ISQED is the pioneer and leading conference dealing with design for manufacturability and quality issues front-to-back. The conference provides a forum to present and exchange ideas and to promote the research, development, and application of design techniques & methods, design processes, and EDA design methodologies and tools that address issues which impact the quality of the realization of designs into physical integrated circuits. The conference attendees are primarily designers of the VLSI circuits & systems (IP & SoC), those involved in the research, development, and application of EDA/CAD Tools & design flows, process/device technologists, and semiconductor manufacturing specialists including equipment vendors. ISQED emphasizes a holistic approach toward design quality and intends to highlight and accelerate cooperation among the IC Design, EDA, Semiconductor Process Technology and Manufacturing communities.
